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Pac Tech - Packaging Technologies
Growth Score
80
CB Rank
505076
Heat Score
45
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Pac Tech - Packaging Technologies provides wafer bumping, packaging, and solder ball placement equipment.
Acquired by
Nagase & Co
Founded
obfuscated
obfuscation
Private
Nauen
,
Brandenburg
,
Germany
11-50
www.pactech.com/
Electronics
Laser
Machinery Manufacturing
Manufacturing
Packaging Services
Semiconductor
Pac Tech - Packaging Technologies
Section: Technology
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