79
42
Growth Score
-9 pts
Heat Score
-12 pts
Company Performance Metrics
Score
Trend
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Growth Score - The measure of growth based on company activity, operational metrics, and investments
Growth Trend - The change in the growth score over the given time period
Heat Score - The measure of the market interest, media activity, and Crunchbase profile activity
Heat Trend - The change in the heat score over the given time period
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547662
Pac Tech - Packaging Technologies provides wafer bumping, packaging, and solder ball placement equipment.
About the Company
Pac Tech GmbH equipment offers semiconductor manufacturers several distinct advantages over other conventional methods. There is virtually no damage to substrates using their patented contactless method of applying solder-balls to fine and thin materials such as those used in hard disk drive
head applications. The electroless wafer bumping method
has a strong advantage in achieving short lead-time and low-cost compared to existing electroplating methods. As semiconductor geometries become smaller and smaller, the need for very fine-pitch solder-ball placement and wafer level packaging will become even more critical.
