79
25
Growth Score
-6 pts
Heat Score
-7 pts
Company Performance Metrics
Score
Trend
AI Content may contain mistakes and is not legal, financial or investment advice.Learn more.
Growth Score - The measure of growth based on company activity, operational metrics, and investments
Growth Trend - The change in the growth score over the given time period
Heat Score - The measure of the market interest, media activity, and Crunchbase profile activity
Heat Trend - The change in the heat score over the given time period
Recent Events
Raised Funding Round
Jan 1, 1970
Lorem ipsum dolor sit amet, consectetur
Raised Funding Round
Jan 1, 1970
Lorem ipsum dolor sit amet, consectetur
Raised Funding Round
Jan 1, 1970
Lorem ipsum dolor sit amet, consectetur
See more interactive data and historical milestones on desktop for the best experience
1542528
Shenzhen Dewo Advanced Automation Corporation is a manufacturer of wire bonding equipment.
About the Company
Shenzhen Dewo Advanced Automation Corporation produces wire bonding equipment, integrating R and D, design, production, and sales. Their products such as semiconductor IC packaging, LED packaging, and precision electronic equipment. Their solutions such as SOP wire bonding solutions, LED packaging wire bonding solutions, SOT23 package wire bonding
solutions, quad flat no-lead packages, quad flat no-lead packages, and quad flat no-lead package, quad flat no-lead packages.
