Company Performance Metrics
- Richard Blickman: CEO & President
BE Semiconductor develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. Its principal products include die attach equipment, such as single chips, multi chips, multi modules, flip chips, TCB and eWLB die bonding systems, and die sorting systems; and packaging
equipment comprising conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems.
BE Semiconductor's principal products also comprise plating equipment consisting of tin, copper, and precious metal plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. It provides its products primarily to chip manufacturers, assembly subcontractors, and electronics and industrial companies.
BE Semiconductor began operation in 1995. It has its headquarters in Duiven in the Netherlands.
