Primary Job Title VP of Engineering Primary Organization Silicon Cloud
Location Geneva, Illinois, United States Regions Greater Chicago Area, Great Lakes, Midwestern US Gender Male
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Joseph K. Lee, Vice President of Engineering, has over 30 years of development and technical management in the field of VLSI semiconductor IC design, networking data communications, client-server, and storage systems.
Prior to joining Silicon Cloud International as co-founder, he was a senior VLSI and SoC chip development engineer at the
the IBM Microelectronics Division. During his professional career at different divisions at IBM, he has been involved in advanced technology leadership roles on multiple large scale VLSI chip development projects.
He was one of the key development engineers who developed the world’s first integrated mixed-signal LAN network controller SoC chip with embedded processor. This SoC chip was used to power and support the IBM Token-Ring LAN networking infrastructure worldwide. Recently, he was involved in the development of a PowerPC-based high performance game processor SoC chip which was used as the main processor for the Microsoft Xbox-360 game console.
He has received the IBM Corporate Outstanding Innovation Award from his invention patent portfolio of 20 patents and many invention disclosure publications. He was also named as one of the IBM Master Inventors who were chartered as a member of the IBM corporate invention patent review board.
In the public technical professional domain, Joe has served as technical committee member and technical sub-working groups chairman in the ITU Study Group 13 International Telecommunication Standardization Organization in Geneva, Switzerland. Joe received his BS and MS in Electrical and Computer Engineering, and an MBA from George Washington University.
