Yuntian Semiconductor - Crunchbase Company Profile & Funding

Q: Where is Yuntian Semiconductor's headquarters?

Yuntian Semiconductor is located in Xiamen, Fujian, China.

Q: Who invested in Yuntian Semiconductor?

Yuntian Semiconductor has 8 investors including Xiamen Venture Capital And CHERAMI.

Overview

Yuntian Semiconductor

Growth Score

Heat Score

Company Performance Metrics

Score

Trend

About These Metrics

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Growth Score - The measure of growth based on company activity, operational metrics, and investments

Growth Trend - The change in the growth score over the given time period

Heat Score - The measure of the market interest, media activity, and Crunchbase profile activity

Heat Trend - The change in the heat score over the given time period

Recent Milestones

Raised Funding Round

Jan 1, 1970

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Raised Funding Round

Jan 1, 1970

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Raised Funding Round

Jan 1, 1970

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See more interactive data and historical milestones on desktop for the best experience

About Yuntian Semiconductor

CB Rank

405219

Yuntian Semiconductor is a semiconductor firm that develops TGV technology, filter wafer-level 3-D packaging technology, and IPD technology.

Founded

obfuscation

Private

Series B

Xiamen, Fujian, China

51-100

www.sky-semi.com/sy

Electronics

Manufacturing

Packaging Services

Semiconductor

Funding Rounds

Series B

OBF

obfuscation

Details

Legal Name

Xiamen Yuntian Semiconductor Technology Co., Ltd.

Also Known As

云天半导体, Sky Semiconductor

Operating Status

Active

Company Type

For Profit

About the Company

Yuntian Semiconductor is a semiconductor firm that develops TGV technology, filter wafer-level 3-D packaging technology, and IPD technology.

Phone Number

+86 0592-3186666-8805

Contact Email

wuwp@sky-semi.com

Predictions & Insights

Growth Prediction

See this Growth Prediction

Products & Services

Wafer Level Package (WLP) and Chip Scale Package (CSP)

Packaging technologies that integrate semiconductor chips at the wafer level, enabling compact and efficient chip packaging.

Through Glass Via (TGV) Technology

A 3D integration technology using glass substrates with vertical vias to enable electrical interconnections in semiconductor devices.

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Financials

Company Funding

Funding Rounds

Investors

Number of Funding Rounds

Unlock company funding data, including rounds, dates, amounts, and investors.

Announced Date	Transaction Name	Number of Investors	Money Raised	Lead Investors	Funding Type
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B

Funding Rounds

Number of Funding Rounds

Unlock company funding data, including rounds, dates, amounts, and investors.

Announced Date	Transaction Name	Number of Investors	Money Raised	Lead Investors	Funding Type
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - Yuntian Semiconductor	8	obfuscated obfuscation	—	Series B

Investors

Unlock company funding data, including rounds, dates, amounts, and investors.

Investor Name	Lead Investor	Funding Round	Partners
Xiamen Venture Capital	—	Series B - Yuntian Semiconductor	—
Xiamen Venture Capital	—	Series B - Yuntian Semiconductor	—
Xiamen Venture Capital	—	Series B - Yuntian Semiconductor	—
Xiamen Venture Capital	—	Series B - Yuntian Semiconductor	—
Xiamen Venture Capital	—	Series B - Yuntian Semiconductor	—