from Tsinghua Unigroup, China’s National IC Industry Investment Fund, and Hubei Local IC Funds, with 24 billion USD total investments. It is an integral and instrumental part of Unigroup’s “from ‘Chip’ to ‘Cloud’” industry ecosystem.

Leveraging XMC’s existing 12-inch IC fab in Wuhan and its R&D capabilities and international partnerships, YMTC successfully designed and manufactured the first 3D NAND flash chip in China in 2017. With R&D centers in Wuhan, Shanghai, Beijing, Silicon Valley, and Tokyo, YMTC is committed to becoming a world leading memory solutions provider through technology innovations.

YMTC is constructing the world’s largest single-floor memory fab with a core plant area of approximately 1.1Km². At its full capacity, the plant will be able to produce 300kWp with annual revenue exceeding 100 billion RMB in 2023.