Overview

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Status
Acquired by on August 19, 2010
Total Equity Funding
$12.56M in 1 Round from 3 Investors
Description:
TPACK provides soft silicon solutions to telecom equipment manufacturers enabling them to build systems faster and with lower risks.
Categories:
Telecommunications, Manufacturing, Communications Infrastructure
Website:
http://www.tpack.com

Funding Rounds (1) - $12.56M

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DateAmount / RoundValuationLead InvestorInvestors
Oct, 2006€10M / Series B3

Investors (3)

InvestorRound(s)Partner(s)
Series B-
Series B-
Series B (Lead)-

News (3)

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Offices/Locations (1)

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  • Office

    Hoerkaer 12A

    2730 Herlev

    ,

    Denmark

Images (1)

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