TopoLogic - Crunchbase Company Profile & Funding

Q: Where is TopoLogic's headquarters?

TopoLogic is located in Tokyo, Tokyo, Japan.

Q: Who invested in TopoLogic?

TopoLogic has 7 investors including Plug and Play Japan And Japan Material Technologies.

Q: When was the last funding round for TopoLogic?

TopoLogic closed its last funding round on obfuscated from a Series B round.

Q: How much funding has TopoLogic raised to date?

TopoLogic has raised obfuscated.

Overview

TopoLogic

Total Funding

obfuscation

Growth Score

Heat Score

Company Performance Metrics

Score

Trend

About These Metrics

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Growth Score - The measure of growth based on company activity, operational metrics, and investments

Growth Trend - The change in the growth score over the given time period

Heat Score - The measure of the market interest, media activity, and Crunchbase profile activity

Heat Trend - The change in the heat score over the given time period

Recent Events

Raised Funding Round

Jan 1, 1970

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Raised Funding Round

Jan 1, 1970

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About TopoLogic

CB Rank

62079

TopoLogic is a technology company that develops high-performance heat flux sensors and memory devices using topological materials.

Founded

obfuscation

Private

Series B

Tokyo, Tokyo, Japan

11-50

www.topologic.jp/

Electronics

Manufacturing

Semiconductor

Sensor

Funding Rounds

Series B

OBF

obfuscation

Series A

OBF

obfuscation

Seed

OBF

obfuscation

Key People

Yu Ito: COO
Taiki Sato: CEO
Past Role: ALI Technologies, Deputy General Manager Of Edge Robotics

Details

Legal Name

TopoLogic Inc.

Operating Status

Active

Company Type

For Profit

Founders

Taiki Sato

Phone Number

+81 50-5897-1707

Contact Email

info@topologic.jp

Predictions & Insights

Growth Prediction

See this Growth Prediction

Top Contributing Factors

Runway Speculation

Products & Services

TL-SENSING™

A heat flux sensor in a dual heat sink QFN package designed for wearable and IoT devices to measure heat flow.

TL-RAM™

A next-generation magnetic memory device using topological materials for fast processing, environmental resistance, and durability.

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Financials

Company Funding

Funding Rounds

Investors

Total Funding Amount

obfuscation

Number of Funding Rounds

Unlock company funding data, including rounds, dates, amounts, and investors.

Announced Date	Transaction Name	Number of Investors	Money Raised	Lead Investors	Funding Type
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B

Funding Rounds

Total Funding Amount

obfuscation

Number of Funding Rounds

Unlock company funding data, including rounds, dates, amounts, and investors.

Announced Date	Transaction Name	Number of Investors	Money Raised	Lead Investors	Funding Type
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B
obfuscated obfuscation	Series B - TopoLogic	—	obfuscated obfuscation	—	Series B

Investors

Unlock company funding data, including rounds, dates, amounts, and investors.

Investor Name	Lead Investor	Funding Round	Partners
Plug and Play Japan	—	Series A - TopoLogic	—
Plug and Play Japan	—	Series A - TopoLogic	—
Plug and Play Japan	—	Series A - TopoLogic	—
Plug and Play Japan	—	Series A - TopoLogic	—
Plug and Play Japan	—	Series A - TopoLogic	—