Summit Interconnect manufactures high-density rigid printed circuit boards with features like staggered microvias, blind/buried vias, back drilling, multiple sequential lamination, via fill, metal backed/metal core, and oversized panel options.

Summit Interconnect produces rigid-flex and flexible printed circuit boards, including bookbinder, multilayer, adhesiveless & adhesive, stiffeners, laser ablation, thin flex laminates, and assembly options.