for die bonding; and phenolic resins, thermoset plastic molding compounds, epoxy coating powders, heat dissipative materials, and molded parts and molding dies, as well as resins for photoresist, and circuitry materials.

The company also provides co-extruded multilayered films and sheets for industrial use and food packaging, heat-resistant PVC sheets, engineering plastics films, pharmaceutical products packaging materials, packaging materials for cosmetics and toiletry products, dicing tapes, PVC and PETG sheets for plastic cards, and carrier tape materials; polycarbonate plates, anti-static plates, ABS plates, acrylic and polystyrene decorative plates, PET plates, PVC plates, PC/ABS alloy plates, and modified polystyrene sheets, as well as halogen-free, flame retardant, and heat resistant sheets; and high-pressure laminates (HPL), high design HPL, flame retardant HPL, melamine-faced solid panels, melamine-faced doors, postform counters, polyester plywoods, edge tapes, high-performance HPL, and laminates. In addition, it offers flexible printed circuits; endoscopic devices, surgery/drainage, and circulation/IVR; substrate materials for semiconductor packages; glycan related products, cryogenic vials, cell culture products, nerve-cell culture system, centrifuge tubes/conical tubes, and low protein adsorption products and ELISA; packaging for producers and vegetable factories, and freshness-keeping zipper bags for household use; and waterproofing for rooftop and pitched roof, solar-cell-integrated waterproof sheets, and waterproofing systems. The company was founded in 1907 and is headquartered in Tokyo, Japan.