76
46
Growth Score
-6 pts
Heat Score
-2 pts
Company Performance Metrics
Score
Trend
AI Content may contain mistakes and is not legal, financial or investment advice.Learn more.
Growth Score - The measure of growth based on company activity, operational metrics, and investments
Growth Trend - The change in the growth score over the given time period
Heat Score - The measure of the market interest, media activity, and Crunchbase profile activity
Heat Trend - The change in the heat score over the given time period
See more interactive data and historical milestones on desktop for the best experience
720897
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication.
Choon Heung Lee: Chief Technology OfficerPast Role: Amkor Technology, Chief Technology Officer- Dennis Chia: CFO
About the Company
STATS ChipPAC Pte. Ltd., together with its subsidiaries, provides semiconductor packaging design, bump, probe, assembly, test, and distribution services for communication, consumer, and computing markets. Its services include post wafer fab process, and back-end assembly and test; document library; and package design center services for customers
to determine the optimum package for complex integrated circuits.
