industry-first products: the 10-nanometer class 16Gb LPDDR4 DRAM chips enable an 8GB mobile DRAM package for high-end smartphones and tablets, and the 15.36TB SAS SSD based on 48-layer 256Gb V-NAND technology delivers the industry’s highest storage capacity for leading enterprise customers. Also, they have further accelerated the growth of the advanced memory segment by bringing leading-edge DRAM and NAND flash-based solutions to the market. Among those, the 8GB HBM2 DRAM and the 8GB LPDDR4/4X mobile DRAM offer exceptionally high speed and bandwidth which are required for next-generation graphics and mobile applications. In the NAND flash sector, consumer SSDs such as the 2TB 960 PRO (M.2 NVMe SSD) and the 2TB T3 (portable SSD) helped the market move toward higher density consumer storage solutions. The 512GB BGA NVMe SSD integrates all essential SSD components in a single, one-gram package, allowing maximized flexibility when designing computing devices.

In 2017, they have been proactively responding to broader market needs from mobile, PC, enterprise, and cloud services to Augmented Reality (AR), Virtual Reality (VR), and automotive applications. To this end, they plan to introduce a more extensive lineup of advanced memory products that deliver unparalleled levels of performance and capacity, including the latest 64-layer V-NAND-based SSDs for consumer and enterprise applications, ultra-compact eUFS, and high-speed Z-SSD. They will also continue their advancements in the 10-nanometer process technology for DRAM solutions and next-generation V-NAND technologies to maintain their leadership and contribute to the growth of the global memory market.