Company Performance Metrics
SAFI-Tech develops advanced metallic joining materials based on supercooled liquid metal microcapsule technology. The company produces supercooled solder pastes and no-heat, low-heat solder products that enable SAC305 and other industry-standard alloys to be processed at significantly reduced temperatures. Its encapsulated liquid metal particles
are suspended in flux to create stencil-printable pastes that flow and solidify when activated, forming full-metal conductive interconnects. These materials are intended for electronics assembly applications including flexible hybrid electronics, heat-sensitive components, and high-density interconnects. By lowering soldering process temperatures, SAFI-Tech’s products support thinner, lighter, and flexible electronic designs while addressing temperature-related manufacturing defects and energy use.