Company Performance Metrics
Stan Piekos: CFO- Carl Eibl: DirectorPast Role: Stratagene, President
NEXX Systems, Inc. provides processing equipment for wafer-level packaging applications. It offers sputter deposition, electro-deposition plating, and plasma cleaning systems. The company’s systems and technologies focus on flip chip advanced packaging, including wafer bumping, wafer cleaning, photoresist strip, and related technologies. Its
electro-deposition systems are designed for long deposition time processes required in applications, such as gold and solder wafer bumping, redistribution layers, and various MEMS layers. The company’s systems offer processing technology to the areas of compound semiconductors, hard disk drive head manufacturing, and ink jet printing. NEXX Systems has representatives and distributors in the United States, Germany, Italy, France, Switzerland, China, Israel, Korea, Japan, Singapore, and Taiwan. NEXX Systems, Inc. was formerly known as Plasmaquest Astex.
NEXX Systems, Inc. was founded in 2001 and is headquartered in Billerica, Massachusetts.
