Company Performance Metrics
High Density Electronics Center operates as a core research and development laboratory for advanced electronic packaging and system integration. The center provides shared facilities for low temperature co‑fired ceramics, power module packaging, electronic assembly, reliability testing, and machining. It offers process capabilities such as LTCC
substrate fabrication, power device packaging, thick and thin film patterning, wire bonding, dicing, encapsulation, and environmental stress testing. High Density Electronics Center supports academic and industrial users with prototyping, characterization, and pilot production of electronic modules and substrates. The center also provides technical assistance, equipment access, and structured training camps in areas like PCB design, soldering, surface mount technology, and wire bonding.
