to produce high quality Diamond wafer and AlN template on various substrate including Si, sapphire, and polished diamond. Our mission is to be the most advanced compound semiconductor company in the global market, contributing to the related technology development. We have strong R&D team and actively collaborate with best research group around the world.

Currently, we are providing the thermal grade polycrystalline diamond, which can be used as an effective heat sink aims to solve the heat issue in temperature sensitive device, such as power devices, lasers and avalanche photodiodes etc. We also provides wafer scale polished diamond with sub-nanometer RMS surface roughness, which might be suitable for the integration of GaN, GaO and AlN epilayers and devices on Diamond via direct bonding or heteoepitaxy.