Company Performance Metrics
Argo was founded in 1969 as a contract electronics assembly manufacturer on Connecticut’s beautiful shore-line. Right from the start, they have been at the forefront of circuit miniaturization technology. Their initial products were high-density resistor networks for scientific research applications at universities and other research institutions.
From these networks, thick and thin film ceramic hybrid circuit assemblies were a natural growth step.
In the mid 1970s they helped pioneer a new technology called Chip On Board (COB) and various Multi Chip Module (MCM) designations. COB formed the initial basic step that led to today’s Ball Grid Array (BGA) technology. In 1975, Argo became involved in the design and manufacture of high quality miniaturized electronic circuits for a broad range of industries.
As active Surface Mount components began to appear in the 1980’s, we saw the possibilities and developed processes to capture this new technology for PCB assembly, while maintaining their position as a leading manufacturer of electronic assemblies. They installed new equipment for solder paste screening, automatic component placement, reflow soldering and assembly cleaning. They helped pioneer the fusion of these technologies to produce circuit layouts designed for size and cost optimization.
In 2002, Argo became the first ISO 9000 registered electronic assembly manufacturer in Connecticut. They followed that milestone with the installation of a third SMT line, an automated optical inspection system and a reflow technology upgrade.
