Applied Seals N.A. - Crunchbase Company Profile & Funding

Overview

Applied Seals N.A.

Heat Score

Company Performance Metrics

Score

Trend

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Growth Score - The measure of growth based on company activity, operational metrics, and investments

Growth Trend - The change in the growth score over the given time period

Heat Score - The measure of the market interest, media activity, and Crunchbase profile activity

Heat Trend - The change in the heat score over the given time period

Recent Milestones

Raised Funding Round

Jan 1, 1970

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Raised Funding Round

Jan 1, 1970

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Raised Funding Round

Jan 1, 1970

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About Applied Seals N.A.

CB Rank

1088787

Applied Seals N.A. provides smart sealing solutions.

Founded

obfuscation

Private

Fremont, California, United States

11-50

www.asnaglobal.com

Product Design

Semiconductor

Key People

Dalia Vernikovsky: CEO and President
Past Role: Brooks Automation, VP Strategic Account Development

Details

Legal Name

Applied Seals N.A., Inc.

Also Known As

ASNA

Operating Status

Active

Company Type

For Profit

About the Company

Applied Seals N.A. offers the design, prototyping, installation, testing, and production of sealing systems. Their product lines are AS568 standard o-ring and custom seals, engineering expertise, finite element analysis, failure analysis, high-performance elastomers, sealing solutions for improved performance, bonded gate technology, smart seals

prism onekit® and clamp with quikvu® windows, ASNA calculated engineering, ASNA smart set®, and best-known method.

Phone Number

+1 510 623 8307

Contact Email

info@asnaglobal.com

Predictions & Insights

Growth Prediction

See this Growth Prediction

Products & Services

PERFREZ® Semiconductor Grade Perfluoroelastomer (FFKM) Compounds

Perfluoroelastomer compounds designed for sealing applications in semiconductor manufacturing, resistant to harsh chemicals and high temperatures.

ASNA Calculated Engineering (ACE®) Tool

An engineering software tool for validating and optimizing seal design dimensions, groove configurations, and material selection for semiconductor sealing applications.