90
Growth Score
pts
Heat Score
51 pts
Company Performance Metrics
Score
Trend
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Growth Score - The measure of growth based on company activity, operational metrics, and investments
Growth Trend - The change in the growth score over the given time period
Heat Score - The measure of the market interest, media activity, and Crunchbase profile activity
Heat Trend - The change in the heat score over the given time period
Recent Milestones
Raised Funding Round
Jan 1, 1970
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Raised Funding Round
Jan 1, 1970
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1113586
3DiS Technologies develops 3D interconnect, packaging, and integrated passive device solutions for wafer-level 3D electronic systems.
About the Company
3DiS Technologies develops 3D integration and 3D packaging solutions for electronic systems. The company focuses on 3D interconnect, 3D redistribution layer, and wafer-level 3D system-in-package technologies that enable miniaturized, high-performance RF and mixed-signal modules. It also designs and supplies 3D integrated passive devices such as
filters, couplers, baluns, inductors, and transformers. 3DiS provides design, simulation, development, prototyping, small-volume production, and technology licensing services to customers in consumer, medical, defense, and space electronics.
