Company Performance Metrics
Arlon EMD manufactures copper‑clad laminates, prepregs, and bondplies for printed circuit board fabrication. The portfolio focuses on polyimide and epoxy resin systems used in high‑temperature rigid and rigid‑flex designs. Offerings include low‑flow and no‑flow adhesives, thermally conductive options, and halogen‑free grades to support diverse
stackups. The company provides datasheets, compliance information, and application guidance for material selection and processing. Products address requirements for electrical stability, thermal endurance, and dimensional control in aerospace, defense, industrial, and communications hardware. Technical support assists OEMs and PCB fabricators with qualification data and recommendations for lamination, drilling, and assembly.
