Company Overview

Update
Status:
Acquired by Applied Micro Circuits
Funding:
$12.5M
Description:
TPACK provides soft silicon solutions to telecom equipment manufacturers enabling them to build systems faster and with lower risks.

Detailed Description

Update

TPACK provides SOFTSILICON solutions to Telecom Equipment Manufacturers that enable them to build systems faster and with lower risk, but also allowing new functionality to be added both during development and in the field.

Funding Rounds (1) - $12.5M

Update

Investors (3)

Update

Offices/Locations (1)

Update
  • Office

    Hoerkaer 12A

    2730 Herlev

    ,

    Denmark

Images (1)

Update
  • 8c3e79a98b4b566dd9ab31cca2a8293d