Status
Acquired by Applied Micro Circuits on August 19, 2010
Funding Received
$12.5 Million in 1 Round from 3 Investors
Description:
TPACK provides soft silicon solutions to telecom equipment manufacturers enabling them to build systems faster and with lower risks.
Website:
http://www.tpack.com

Detailed Description

Update

TPACK provides SOFTSILICON solutions to Telecom Equipment Manufacturers that enable them to build systems faster and with lower risk, but also allowing new functionality to be added both during development and in the field.

Funding Rounds (1) - $12.5M

Update

Investors (3)

Update

Offices/Locations (1)

Update
  • Office

    Hoerkaer 12A

    2730 Herlev

    ,

    Denmark

Images (1)

Update
  • 8c3e79a98b4b566dd9ab31cca2a8293d