Status
Acquired by Applied Micro Circuits on August 19, 2010
Funding Received
$12.5 Million in 1 Round from 3 Investors
Description:
TPACK provides soft silicon solutions to telecom equipment manufacturers enabling them to build systems faster and with lower risks.
Website:
http://www.tpack.com

Company Details

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Funding Rounds (1) - $12.5M

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Investors (3)

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Offices/Locations (1)

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  • Office

    Hoerkaer 12A

    2730 Herlev

    ,

    Denmark

Images (1)

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  • 8c3e79a98b4b566dd9ab31cca2a8293d