Funding Received
$43 Million in 5 Rounds from 7 Investors
Most Recent Funding
$5 Million Debt Financing on June 26, 2013
Headquarters:
Hillsboro, OR
Description:
NexPlanar builds chemical mechanical planarization pads using its proprietary nano-domain technology for the semiconductor device industry.
Categories:
Semiconductors
Website:
http://www.nexplanar.com

Company Details

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NexPlanar builds chemical mechanical planarization (CMP) pads for the semiconductor device industry. Their propriety nano-domain technology coupled with patented molded grooves and the unique ability to tune the pads results in dramatically improved yields and lower cost of ownership with extended pad life.

The company manufactures in Hopkins, Minnesota and at its new headquarters in Hillsboro, Oregon.

Current Team (7)

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Past Team (1)

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Funding Rounds (5) - $43M

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Board Members and Advisors (1)

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Investors (7)

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Offices/Locations (1)

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  • Office

    7425 NW Evergreen Parkway

    Suite 150

    Hillsboro, OR 97124

    USA

Images (1)

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  • 89a023aa9dc37bdee87982eadb3a48a4