|Acquired by||Tokyo Electron|
|Description||Water Level Packaging Semiconductors|
|Series C, 9/05 |
|Series D, 10/09 |
|Series D, 12/09 ||$1.25M|
NEXX Systems, Inc. provides processing equipment for wafer-level packaging applications. It offers sputter deposition, electro-deposition plating, and plasma cleaning systems. The companyâ€™s systems and technologies focus on flip chip advanced packaging, including wafer bumping, wafer cleaning, photoresist strip, and related technologies. Its electro-deposition systems are designed for long deposition time processes required in applications, such as gold and solder wafer bumping, redistribution layers, and various MEMS layers. The companyâ€™s systems offer processing technology to the areas of compound semiconductors, hard disk drive head manufacturing, and ink jet printing. NEXX Systems has representatives and distributors in the United States, Germany, Italy, France, Switzerland, China, Israel, Korea, Japan, Singapore, and Taiwan. NEXX Systems, Inc. was formerly known as Plasmaquest Astex.
NEXX Systems, Inc. was founded in 2001 and is headquartered in Billerica, Massachusetts.