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Nextreme Thermal Solutions

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Nextreme designs and manufactures micro-scale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries. The company has embedded cooling and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging.

Nextreme’s breakthrough addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, high-volume flip chip manufacturing infrastructure. By minimizing the need for manufacturing changes and focusing on developing a seamless design-in solution, Nextreme is changing the future of thermal and power management for the entire electronics industry.

Recent Milestones

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• 
  Nextreme Thermal Solutions received $13M in Series B funding. (8/6/08)
  Posted 12/21/08 at 12:08pm via embedded-computing.com
• 
  Nextreme Thermal Solutions received $8M in Series A funding. (3/4/05)
  Posted 12/21/08 at 12:08pm via insidechips.com
• 
  Nextreme Thermal Solutions added Jesko von Windheim as CEO.
  Posted 12/21/08 at 12:08pm
• 
  Nextreme Thermal Solutions added James Mundell as Senior Vice President & General Manager.
  Posted 12/21/08 at 12:08pm

Videos

Screenshots

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Traffic Analytics

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Sources

1. Nextreme Thermal Solutions Raises $8 Million (insidechips.com) [edit]
2. Nextreme Raises $13 Million in Series B Financing (embedded-computing.com) [edit]