| Website | nextremethermal.com |
| Category | Consumer Electronics/Devices |
| Phone | 919-597-7300 |
| Employees | |
| Founded | 2004 |
| Total | $27M |
| Series A, 2007 | $14M |
| Series B, 8/08 Chart Venture Partners RedShift Ventures Harris & Harris Group In-Q-Tel | $13M |
Nextreme designs and manufactures micro-scale thermal and power management products for the semiconductor, photonics, consumer, automotive and defense/aerospace industries. The company has embedded cooling and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging.
Nextreme’s breakthrough addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, high-volume flip chip manufacturing infrastructure. By minimizing the need for manufacturing changes and focusing on developing a seamless design-in solution, Nextreme is changing the future of thermal and power management for the entire electronics industry.
