| Website | intermolecular.com |
| Category | Semiconductor |
| Phone | (408) 416-2300 |
| inquiry@intermole... | |
| Employees | |
| Founded | 2004 |
| Description | Semiconductor components |
| TOTAL | $47.6M |
| FUNDING TOTAL | $47.6M |
| Series C, 9/06 CMEA Ventures Redpoint Ventures U.S. Venture Partners | $27.6M |
| Series D, 1/09 Redpoint Ventures CMEA Ventures US Venture Partners Symyx | $20M |
Intermolecular provides high productivity combinatorial (HPC) technology products and services. The company offers Tempus HPC Platform, an integrated processing and informatics system that stimulates materials discovery, process development, and IC device integration for chipmakers, materials suppliers, and equipment manufacturers. It also offers wet workflow systems for self-assembly processing, electroless deposition, wet etching and stripping, cleaning, and surface preparation applications; ALD and PVD workflow systems; and HPC test chips. The company serves pharmaceutical, biotechnology, and energy industries.
| Website | intermolecular.com/sites/all/the... |
This tool is a key part of the wet workflow that allows for precise automatic creation of formulations—especially those involving powders, viscous liquids and pH-measurement adjustment.
| Website | intermolecular.com/sites/all/the... |
Enabling massively parallel screening of materials and process, this tool is used for library creation as well as processing wafer coupons. It is ideal for primary and or secondary combinatorial screening, enabling the user to generate thousands of characterizations with reduced resource requirements. The Tempus F-20 supports testing on both wafer coupons as well as within a vial block.
| Website | intermolecular.com/sites/all/the... |
This tool allows collection of comprehensive data sets from patterned wafers for integration and scale-up to high-volume manufacturing tools. It enables collection of comprehensive data sets from full-patterned wafers, allowing direct comparisons to current processes of record, and further reductions in development time and R&D costs.
